它是用於2-12英寸矽晶片的電鍍裝置。 半導體精密電鍍·MEMS·微機械可以使用專用夾具完成。 槳葉攪拌用於在一個結構中進行直接攪拌，該結構在不斷過濾的同時會導致水箱底部溢流和輕微對流。 它也可以用作生產設備。
（在日本和海外已獲得多項專利，還有其他幾個申請正在提交）

標準尺寸為2至12英寸，但我們可根據要求製造各種類型的設備。 （有完全密封型和非密封型夾具·臥式等）。

* PC單獨販售

A-52 用実験装置  2～12inch用装置。専用治具使用、半導体・MEMS・精密行。常時過行水槽底部対流起、構造、直接撹拌撹拌利用。生産設備利用。
（国内外特許数件取得済、他数件出願中）

標準2～12inch、 要望、各種希望装置製作致。（完全密閉型非密閉型治具・水平式等）。

＊PC別売

Plating set for 2～12 inch silicon wafers. By using dedicated jigs, precision plating of semiconductors, MEMS and micromachines is possible. The set is designed with overflow-mechanism, which generates a gentle convection from the base of the tank, while conducting constant filtration. Paddle agitators are used for actual agitation. The set can also be used as production facility. (PC is sold separately)
(Several patents acquired and pending in Japan and abroad.)

Applicable standard size is 2～12inch, but we can accommodate your request to manufacture sets that meet various needs.
(Various types are such as fully sealed/non-sealed-type jigs, horizontal-type are available.)
*Please contact us for detail by e-mail.